Picosecond Laser Cutting Machine (UV/IR/Green Light)
We provide comprehensive laser solutions for precision processing in the glass industry. Key features include cold processing, high precision, low edge breakage, stress-free operation, high efficiency, and environmental friendliness. It is particularly suitable for processing ultra-thin, irregular, or high-demand glass components.
Equipment Advantages:
Key Configurations & Performance:
Chipping ≤ 5μm (industry-leading), positioning accuracy ±3μm, and edge strength approximately 2.5 times higher than traditional cutting methods. No secondary grinding or polishing is required.



| Laser power | 30W | Dimensions | 2200*1500*1750mm |
| Working area | 500*610mm | Certification | CE |
| Positioning Accuracy | ±1um | Machinery Test Report | Provided |
| Processing speed | ≤3000mm/s | Video outgoing-inspection | Provided |
| Processing accuracy | ≤30um | Warranty of core components | 12 Months |
| Focus Spot | ≤20um | Applicable Industries | Solar panels, 3C Electronics |

Established in 2012, our facility is a national high-tech enterprise owning over 150 national patents. We operate 80,000 square meters of production space across multiple R&D and sales bases. Our products are exported to more than 100 countries, providing high-quality equipment and efficient services to industrial customers worldwide.





1. We provide comprehensive technical support, including remote video guidance and professional consultation.
2. We guarantee a stable supply of genuine parts and high-quality consumables to ensure optimal operating conditions.